From Ultra-Thin Materials to Traceability: New Possibilities in Packaging Substrate Design

Miniaturization continues to place new demands on packaging substrates, particularly in terms of material thickness, traceability and manufacturing capabilities. Based on a newly developed packaging substrate sample, this presentation provides insights into several design features that enable smaller and more highly integrated electronic solutions. Topics include ultra-thin materials, component-level traceability and selected design approaches for further miniaturization. The presentation will also address the role of Swiss and European manufacturing in supporting reliable and resilient electronics supply chains, with a focus on technological capabilities, flexibility and proximity to customers.