Utra-Thin Parylene-Based Printed Circuit Boards for Highly Miniaturized Flexible Electronics

Our newly developed ultra-thin Parylene-based printed circuit board (PCB) for the next generation of flexible electronics is presented. For this PCB, Parylene serves as a substrate, dielectric, and encapsulant utilizing its unique properties. These include: dielectric properties, optical transparency, chemical inertness, biocompatibility, and low permeability with robust mechanics at minimal thickness. For the new ultra-thin PCB, metallic redistribution layers and Parylene are stacked to form boards of 20 µm thickness or less. For the integration, established technologies, such as soldering and wire bonding, were adapted, and new technologies including embedding and transfer were developed.