Daniel Schulze

Daniel Schulze serves as the Director of the Application Engineering team at DYCONEX AG, focusing on technical consulting and customer support for next-generation flexible, rigid-flex, and rigid ultra-HDI/microvia circuit boards, as well as LCP and advanced chip packaging solutions. He joined DYCONEX AG — one of the world’s leading providers of miniaturized, highly complex, and exceptionally reliable interconnect solutions in 2005, and by 2008, he led the Product Engineering group, spearheading product development for advanced medical imaging PCBs, hearing aids, and cochlear implants as well as industrial and high-frequency LCP products. Daniel holds a degree in electrical engineering from the Technical University of Dresden, where his groundbreaking diploma thesis focused on the development of photolithographically structured optical waveguides embedded in PCBs to achieve higher data rates and reduced packaging density. He further advanced his expertise at the prestigious Georgia Tech Packaging Research Center, concentrating on state-of-the-art SOP process development for ultra-high-density interconnects. Daniel’s extensive knowledge and commitment drive cutting-edge innovations in interconnect technology for critical medical and industrial applications. Daniel Schulze serves as the Director of the Application Engineering team at DYCONEX AG, focusing on technical consulting and customer support for next-generation flexible, rigid-flex, and rigid ultra-HDI/microvia circuit boards, as well as LCP and advanced chip packaging solutions. He joined DYCONEX AG — one of the world’s leading providers of miniaturized, highly complex, and exceptionally reliable interconnect solutions in 2005, and by 2008, he led the Product Engineering group, spearheading product development for advanced medical imaging PCBs, hearing aids, and cochlear implants as well as industrial and high-frequency LCP products. Daniel holds a degree in electrical engineering from the Technical University of Dresden, where his groundbreaking diploma thesis focused on the development of photolithographically structured optical waveguides embedded in PCBs to achieve higher data rates and reduced packaging density. He further advanced his expertise at the prestigious Georgia Tech Packaging Research Center, concentrating on state-of-the-art SOP process development for ultra-high-density interconnects. Daniel’s extensive knowledge and commitment drive cutting-edge innovations in interconnect technology for critical medical and industrial applications.