Bosch Rexroth offers advanced sub-assembly solutions tailored to the unique demands of the industry, focusing on high precision, cleanliness, and security. These solutions support critical front-end processes such as wafer handling in deposition, etching, and inspection, as well as back-end processes like hybrid bonding, packaging, and final testing. Rexroth’s portfolio includes linear motion systems, high performance motion control, mechatronic modules, and cleanroom-certified components designed to meet ISO class standards. In my presentation, I show how mechatronic sub-assemblies are designed to speed up time to market, and to integrate seamlessly in machines.
