Lecture
(C12-2) Engineering the AI Era: Accelerating Innovation from Chiplets to Complete Systems
- at -
- Hall C6C6.241
- Language: English
- Type: Keynote
Lecture description
As demand for performance, bandwidth, and energy efficiency accelerates, the industry is moving beyond monolithic scaling toward chiplets, heterogeneous integration, and advanced 2.5D and 3D packaging. These technologies unlock unprecedented system capability—but also create a new engineering challenge: optimizing the chip, package, interconnects, thermal environment, and system as one tightly coupled whole.
This keynote explores:
The emerging engineering paradigm for designing AI-scale systems
How multiphysics simulation, digital twins, connected workflows, and AI-driven engineering can move decisions earlier, expose cross-domain trade-offs, and reduce costly design iterations from architecture through signoff
