Maurice Clair

Maurice Clair studied Mechanical Engineering at the University of Technology Chemnitz (Germany). He joined 3D-Micromac in 2005 as a development engineer and is now team leader of the technology and innovation management department. In his current role, he serves as the technical lead for ohmic contact formation on SiC (silicon carbide) materials, a critical area in advancing semiconductor technologies. Through his expertise in laser technologies, he has been instrumental in the development of innovative laser micromachining processes, including: laser trimming techniques for fine-tuning electronic components with both digital and analogue approaches and beam shaping for ultra-short pulsed lasers.