Andreas Ostmann, born 1966 in Berlin, studied Physics and received his Ph. D. in Micro System Technologies at the Technical University of Berlin. Since he joined Fraunhofer IZM in 1992, his research focus is on advanced packaging technologies. He is head of the department System Integration and Interconnect Technologies. His research group has 30 members and is involved in the developed of large-area processes for chip embedding, System-in-Package and advanced substrates. Andreas is author of a large number of publications and holds several patents on advanced packaging technologies.
