Forums at productronica: Where Knowledge Meets Innovation

Experience forward-thinking presentations, expert panels, and networking opportunities – forums at productronica deliver concentrated know-how on electronics manufacturing and technologies of tomorrow.

productronica Forum A1

Innovation Forum B2

PCB & EMS Marketplace B3

Cleanroom Demonstration

Guided Tour

Flussmittelfrei, zuverlässig, effizient: Löten mit Ameisensäure bei Rehm Faster, cheaper, customized: cost-competitiveness with data-driven manufacturing - enabled by intelligent production equipment Novel Solder Alloy Systems offering High Reliability and Reduced Process Temperatures in PCB Soldering vAI ProVision: Inspektion auf einem neuen Level Overcoming miniaturization challenges in automotive and semiconductor electronics Cleaning in Scope of Mission-Critical Electronics How Automation Transforms in SMEs the PCB Assembly Mission-critical devices - sicher und zuverlässig Part of the risk management – Securing the necessary resources and supply chain through targeted development of electronics.Application of Various Options for Solder Paste Printers Laser-based Annealing of Nickel Contacts for SiC Devices: Towards Thermally Robust Power Interfaces in 3D Integration Smart Power – Flexible Systems for Power Electronics Metal Oxide Reduction Using Inline Openair-Plasma Process to Enhance Adhesion and Improve Durability in Electronics Innovative Laser Welding Process of Cables for Power Electronics Scalable High-Precision Power Amplifiers (HiPPAs) for Mission-Critical Electromechanical Systems Improving form factor, reliability and efficiency of power electronics through embedding of power semiconductors into PCB Modularer Batterieumrichter für beliebige Spannungsformen und Einsatzfelder Manufacturing micro-optical systems for quantum cryptography 3D-Multilayer Devices: Drucken von Kupfer-Multilayern auf dreidimensionalen Oberflächen mittels Lasermaterialbearbeitung Nachrüstung von Lüfter-Filter-Modulen (FFU) an Maschinen für das Back-End Nachhaltigkeit in der Halbleiterproduktion: Wie moderne Abluftreinigungstechnik zur umweltfreundlicheren Lieferkette beiträgt Future Talks Elektronikproduktion Future Talks Elektronikproduktion Beste Leistung vs. beste Kosten – ein Vergleich von Modulsintern und Löten High-Yield Sintering of Molded Power Modules on Heatsinks for High-Performance Electric Vehicle Applications Symbiose und Kreislaufwirtschaft: die Zukunft der Elektronik?Nachhaltige Reinigung in der Elektronikindustrie - Ressourcen sparen, Qualität sichern Flex PCB Etching is Past its Prime – Dry Phase Patterning on the Rise Bridges over troubled waters – sichere Steuerung von Supply Chains in wilden Zeiten The Next Level – Successful Thermal Management with a New Generation of Printable Heatsinks Cutting costs with SMT & THR – A TCO perspective AI That Delivers: How STARTEAM Increased Utilization by up to 20% without Investing in New Equipment Driving Growth Through Innovation: The Role of Additive Processes in Electronics Manufacturing Programable surfaces for electrical connectivity and semiconductors cleanroom 360° - Guided Tour cleanroom 360° - Guided Tour cleanroom 360° - Guided Tour Future Packaging Live-Produktionslinie Future Packaging Live-Produktionslinie

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