Lecture

Transforming Semiconductor Technology: Where AI Meets Advanced Packaging

  • at -
  • Hall A1A1.105
  • Language: English
  • Type: Lecture

Lecture description

Mr. Christian Stöhr will introduce Muehlbauer’s high-end die sorting portfolio.

Our DS Merlin, Albatross, DS Variation Eco, and Variation PRO are designed for high flexibility. They can handle dies with a wide range of sizes, from 0.15 mm to 50 x 50 mm, and die thicknesses of 50 µm or less. We have all kinds of options, from low volume to high mix and high-speed production, as well as fast changeover and rapid prototyping.

Our state-of-the-art AOI vision capability, supported by AI, enables high-end microscopic-level defect detection down to 3 µm with 1 µm per pixel resolution, if required, for the highest possible yield, which we are showcasing at Productronica.

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