Precision in the Nanometer Range: Advanced Optical Metrology for 3D Integration and Advanced Packaging

Advanced packaging and 3D integration require highly precise, non-destructive metrology to control increasingly complex surface structures and materials. Optical measurement techniques such as confocal microscopy, white light interferometry, and scattering-based methods provide complementary insights into topography, planarity, and defectivity. By combining these approaches within hybrid metrology concepts, process control and yield optimization can be significantly improved. This presentation highlights recent developments and practical applications of advanced optical metrology as a key enabler for next-generation semiconductor packaging.