This presentation discusses the benefits for the hole quality attributes of microvia drilling with a green picosecond laser, compared to the traditional laser drilling technologies. Characteristics of laser drilled blind vias can be optimized to achieve specified sidewall quality features. Furthermore, the drilling results with picosecond laser technology provide a clean landing surface with minimal effect on the copper target pad which improves the microvia interfacial adhesion. In other PCB laser processes, such as routing or structuring, the results show that laser pulse widths in the picosecond range applied into the materials lead to high quality PCB processing.
