In ICT, even slight probe misalignment can cause false failures, costly retests, and reduced yield, yet manual inspection is slow and error-prone. This lecture introduces PicAI, a patented automated inspection system that combines AI, high-resolution imaging, and precision mechanics to verify probe alignment by detecting test point marks on PCBs. Inspecting both sides simultaneously, it adapts to varied board types, delivering fast, objective, repeatable results while boosting yield, reducing rework, and extending fixture life.
