Lecture
Novel Solder Alloy Systems offering High Reliability and Reduced Process Temperatures in PCB Soldering
- at -
- Hall A1A1.105
- Language: English
- Type: Lecture
Lecture description
Description: Advancements in solder paste technology will be discussed, with a specific focus on Automotive applications, including novel mixed alloy systems that offer extended device lifecycles through enhanced reliability performance, or energy savings with lower process temperatures compared to industry standard lead-free solders.
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