In this study delamination between EMC and copper lead frame is investigated using the button shear test. Using plasma activation and plasma reduction of the metal surface in combination with adhesion promoting coating deposition, it has been possible to highlight the clear influence of metal oxide initially present on the adhesion values in comparison with untreated reference sample. For the three different EMCs considered in this work, benefits of plasma reduction and plasma thin film deposition have been identified especially after adhesion testing condition at high temperature.
