Lecture

Integrating Design-to-Fab Workflows in Semiconductors: Linking Design and Process Models via Multi-Sigma® AI Chain Analysis

  • at -
  • Hall A1A1.105
  • Language: English
  • Type: Lecture

Lecture description

Multi-Sigma® AI Chain Analysis links design surrogates with process models across key steps of semiconductor development and fab. Where raw data cannot be shared, teams exchange models securely, enabling AI/ML-guided decisions that improve performance and yield, shorten cycles, and reduce environmental impact. This lecture shows how to connect design and manufacturing workflows, run cross-domain co-optimization, navigate multi-objective trade-offs, and apply contribution analysis to reveal leverage points. A short demo video will highlight practical deployment patterns.

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