The embedding of power semiconductors in printed circuit boards is currently attracting tremendous attention. Since the market launch of the p² Pack Technology in 48V applications in 2023, the number of applications for this technology has been increasing. There is also a very high demand for high-voltage applications, e.g. in the field of drive inverters for Battery-Electric-Vehicles (BEV), as users are very interested in the proven efficiency improvement, the increase in power density and the high reliability of this technology. The presentation will cover the current state of development and provide an outlook on future optimizations.
