Lecture
High Performance Thermal Interface Materials enabling AI Applications
- at -
- Hall A1A1.105
- Language: English
- Type: Lecture
Lecture description
Description: Metal-based, compressible Thermal Interface Materials (TIMs) offering superior thermal and lifecycle performance compared to traditional organic-based solutions will be discussed. These attributes are critical to address the thermal dissipation requirements for processor-heavy high performance computing applications including AI.
