Surface Mount Technology and Through-Hole Reflow soldering offer a powerful combination to reduce Total Cost of Ownership in electronics manufacturing. By streamlining production, minimizing manual soldering, and enabling automation companies can achieve up to 40% cost savings, even for large components. This presentation explores the transition from THT to SMT+THR, highlighting design-to-cost strategies, operational benefits, and real-world use cases that demonstrate how modern connectivity solutions drive efficiency and reliability.
