Cross-Process Optimization in Semiconductors: Linking Process Models via Multi-Sigma® AI Chain Analysis

Multi-Sigma® AI Chain Analysis links process models across critical fab steps (e.g., lithography, etch, and clean). Where raw data cannot be shared, teams exchange models securely, enabling AI/ML-guided decisions that raise yield, improve throughput, shorten cycles, and reduce environmental impact. This lecture shows how to connect process workflows, run cross-step co-optimization, navigate multi-objective trade-offs, and apply Contribution Analysis to identify leverage points. A short demo video will highlight practical deployment patterns.