Substrates for chiplet systems must overcome a number of challenges. Their connection density must allow the chiplet wiring to continue seamlessly. This necessitates structure widths of just a few µm and minimal electrical losses. Although substrates based on organic cores are a proven technology, they reach their limits with very high connection densities. Glass core substrates can address these geometric challenges and facilitate multiple sub-µm wiring layers in the future.
This presentation will outline some aspects of the process flow for glass core substrates. A study will demonstrate where a transition from organic to glass cores is necessary to achieve the geometric stability.
