Laser depaneling provides outstanding precision and the highest technical cleanliness, ensuring stress-free processing and superior edge quality. Yet, its performance depends on wavelength, source, and processing strategy, which can limit applicability across different board types. SCHUNK addresses this challenge with a platform that combines laser and milling in one system. Operated in solo, alternating, or combined modes, it ensures reliable separation for a wide range of PCB materials, meeting the diverse demands of industries such as power electronics, medical technology, and automotive. With exchangeable laser sources, inline integration, and versatile workpiece handling, this solution redefines flexibility in next-generation electronics manufacturing.
