Wolfgang Eberhardt studied chemistry in Tübingen and obtained his doctorate there at the Institute of Organic Chemistry. Since 1998, he has been with Hahn Schickard at the Institute for Micro Assembly Technology in Stuttgart. His focus is on metallization and laser structuring of 3D circuit carriers and technologies for foil based substrates as well as assembly and connection technology. He is currently head of the technology department at Hahn-Schickard.