Heiko Dudek

Heiko Dudek is a Technology Manager at Siemens Digital Industries Software, where he focuses on 3D IC design and advanced heterogeneous packaging solutions. He works with semiconductor companies, research organizations, and technology partners to develop methodologies and workflows for chiplet-based system design, multi-die integration, and advanced packaging. Heiko is actively involved in industry initiatives supporting the European semiconductor ecosystem and regularly speaks on topics including heterogeneous integration, chiplet technologies, system technology co-optimization (STCO), and next-generation electronic systems design.