This Keynote is presented by Riccardo Nicoloso, General Manager, STMicroelectronics.
New wide-bandgap materials allow more efficient management of electrical energy and are driving significant performance improvements in the most critical power electronics applications, such as renewable power generation and transmission, electromobility, energy-efficient data centers for AI, automation, smart cities, and smart homes. Package innovations are integral to evolving SiC and GaN technologies in their capacity to deliver the full operating benefits of these device technologies to various application contexts and challenges. ST is an established leader with a detailed production and investment roadmap for a growing portfolio of products covering industrial and automotive applications, to meet growing demand for wide-bandgap power devices.