(P11-2) Panel Discussion: Vertical Power Delivery (VPD) - Challenges and Opportunities

This Panel Discussion with Industry Experts is moderated by Aalyia Shaukat, Editor-in-Chief, Power Electronics News

As AI accelerators push toward multi-kilowatt thermal design power (TDP) and thermal design current (TDC) demands approach 8,000 A per processor, the power electronics industry faces a growing challenge. Core voltages continue to fall, now below 1 V, while compute performance requirements climb. At these scales, routing power laterally through a PCB can account for major losses. The answer, increasingly, is vertical power delivery (VPD): placing power conversion as close to the processor as physically possible. But the path to true vertical integration is not simple.