Christian Hoffmann is currently employed by RF360 Europe GmbH (Qualcomm) as a Principal Engineer in the New Technology Business Development department in Munich. He received a diploma in Physics from Aachen University of Technology in Germany, as well as a doctoral degree in Electrical Engineering from the same university. Mr. Hoffmann has extensive experience in material science and RF engineering and has held a variety of positions within the RF360 organization and related entities over the course of 27 years including VP Corporate Material Research in Austria, Senior Chief Researcher in Tokyo, Japan, and as a member of the CTO Office in Munich, Germany. His focus is on RF materials, packaging, and RF engineering.